The ELASTIC bellows are used e.g. for lifting table appications or round sewn as an alternative to spiral springs to protect shafts , columns and spindles . In the design as a Laminat bellows this has a high inherent rigidity due to the combination of two materials . As a bellow for jet cutting ... Read More

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2017 hot and popular products for christmas day , new year ! LED Flame effect simulatd nature fire light , just like a warm fire in the cold winter . bring us warm ,light ,romantic ! E27 E14 E26 B22 LED burning light flicker flame lamp bulb fire effect decorative lamp . LED Flame Fire Light Features... Read More

Prodcution sockets are meant to socket the IC in the end application . some benefits are to allow field upgrades , eliminate the need to solder the IC after the assembly has been made etc . hilo BGA socketing system BPE /FPA BGA Socketing system BPE BGA socketing system FPA BGA Socket pin-fields ( ... Read More

Test & burn-in sockets are through-hole mounted and typical use a clamshell or open-top lid BGA MICRO BGA DIP FLATPACK -MILITARY HGA -INTERSTITIAL LAP LCC MAP MLF/QFN PGA PLCC PQFP/TQFP SDIP -SHRINK DIP SOIC SOJ SOP SOT SSOP /TSSOP TAP TSOP Read More

prototyping boards PCMCIA/PCCARD prototyping boards BGA.QFN (0.5MM -1.27MM lead pitch) PLCC (50 mil spacing ) QFP 20 mil spacing QFP 25 MIL SPACING SOIC 50 MIL SPACING SOIC 50&25 MIL SPACING TSOP , PSOP , SSOP 30 MIL SPACING GENERAL PURPOSE PROTOTYPING BOARDS TEST FIXTURE BOARDS Read More

programming adapters index by package type : BGA DATAFLASH DIP FLATPACK LAP MAP LCC QFN/MLF QFN/MLF 3 IN1 ADAPTER PGA PLCC PQFP/TQFP SDIP SOIC SOJ SSOP TSOP TSSOP Read More