Prodcution sockets are meant to socket the IC in the end application . some benefits are to allow field upgrades , eliminate the need to solder the IC after the assembly has been made etc .

hilo BGA socketing system

BPE /FPA BGA Socketing system 

BPE BGA socketing system 

FPA BGA Socket pin-fields ( top-side pads receive BGA)

FPA-BL BGA socket pin-fields ( top -side pads with solder balls receive BGA)

XPA BGA Socket extenderd length pin-field ( top-side pads receive BGA)

SDIP ( SHRINK DIP)

DIP 

LCC 

PLCC 

PQFP/TQFP 

LCC 

PLCC 

PSOP 

SOIC 

SOJ

SSOP/TSSOP 

TSOP /TSOPII 

MALE- TO -MALE 

BGA 

SDIP 

DIP 

HGA 

PGA